Extra exam question E6E12
Subelement E6, CIRCUIT COMPONENTS· Group E6E
Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
- A.Excessive dielectric loss
- B.Epoxy coating is conductive above 300 MHz
- C.Excessive lead length (correct answer)
- D.Unsuitable for combining analog and digital signals
WhyDIP through-hole package ICs aren't typically used at UHF and higher frequencies because of their excessive lead length. DIP through-hole ICs aren't typically used at UHF and higher frequencies because their relatively long pin leads add significant parasitic inductance, which becomes a serious problem as wavelength shrinks and even a short lead becomes electrically significant, answer C. Dielectric loss and epoxy coating conductivity aren't the real limiting factor, and DIP packages aren't specifically unsuited to mixing analog and digital signals, that's unrelated to the high-frequency lead-length problem.
Published 2026-08-28 · Last updated 2026-08-28 · Question text is verbatim from the 2024-2028 NCVEC Element 4 pool (public domain); the explanation above is original writing, see our methodology.
Related questions
- E6E01Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
- E6E02Which of the following device packages is a through-hole type?
- E6E03Which of the following materials supports the highest frequency of operation when used in MMICs?
- E6E04Which is the most common input and output impedance of MMICs?
- E6E05Which of the following noise figure values is typical of a low-noise UHF preamplifier?