Extra exam question E6E02
Subelement E6, CIRCUIT COMPONENTS· Group E6E
E6E02
Which of the following device packages is a through-hole type?
- A.DIP (correct answer)
- B.PLCC
- C.BGA
- D.SOT
WhyDIP is the through-hole device package among these choices. DIP, dual in-line package, is a through-hole device package, its two rows of pins are meant to be inserted through holes in a circuit board and soldered on the opposite side, answer A. PLCC, BGA, and SOT are all surface-mount package types, mounted directly onto pads on the board's surface rather than through drilled holes.
Published 2026-08-28 · Last updated 2026-08-28 · Question text is verbatim from the 2024-2028 NCVEC Element 4 pool (public domain); the explanation above is original writing, see our methodology.
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