Extra exam question E6E11
Subelement E6, CIRCUIT COMPONENTS· Group E6E
E6E11
What is a characteristic of DIP packaging used for integrated circuits?
- A.Extremely low stray capacitance (dielectrically isolated package)
- B.Extremely high resistance between pins (doubly insulated package)
- C.Two chips in each package (dual in package)
- D.Two rows of connecting pins on opposite sides of package (dual in-line package) (correct answer)
WhyDIP packaging has two rows of connecting pins on opposite sides of the package, a dual in-line package. DIP stands for dual in-line package, describing its physical layout: two parallel rows of pins running along opposite sides of the package, answer D. It has nothing to do with dielectric isolation, doubly insulated pin spacing, or housing two separate chips in one package, those aren't what "dual in-line" actually refers to.
Published 2026-08-28 · Last updated 2026-08-28 · Question text is verbatim from the 2024-2028 NCVEC Element 4 pool (public domain); the explanation above is original writing, see our methodology.
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